PANews 4月28日消息,据TechCrunch报道,曾多次披露苹果硬件计划的Ming-Chi Kuo表示,OpenAI正与联发科、高通和立讯精密合作开发智能手机,芯片由OpenAI与联发科、高通共同设计,立讯精密担任联合设计和制造合作伙伴。该手机可能以AI代理取代传统应用程序,通过持续理解用户上下文完成任务,结合小型端侧模型和云端模型处理不同请求。规格和供应商预计在2026年底或2027年第一季度确定,量产预计2028年开始。OpenAI首席全球事务官此前表示公司将在2026年下半年推出首款硬件产品,此前报道称可能是耳塞。
OpenAI或正在打造一款以AI代理取代应用程序的手机
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